Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

Cu-Sn solid–liquid interdiffusion (SLID) bonded joints were fabricated using a Sn-Cu solder paste and Cu for high-temperature power electronics applications. The interfacial reaction behaviors and the mechanical properties of Cu 6 Sn 5 and Cu 3 Sn SLID-bonded joints were compared. The intermetallic compounds formed at the interfaces in the Cu-Sn SLID-bonded joints significantly affected the die shear strength of the joint. In terms of thermal and mechanical properties, the Cu 3 Sn SLID-bonded joint was superior to the conventional solder and the Cu 6 Sn 5 SLID-bonded joints.