Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding

Journal of Lightwave Technology, pp. 307-313, 2019.

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Abstract:

A precise flip-chip bonding (FCB) technology for indium phosphide semiconductor optical amplifiers (InP-SOAs) on a silicon photonics platform within less than ±1- <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">μ</italic> m alignment accuracy was developed. For efficient optical coupling a...More

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