Fabrication and Characterization of Electrical Interconnects and Microfluidic Cooling for 3D ICS With Silicon Interposer

HEAT TRANSFER ENGINEERING, pp. 903.0-911.0, 2016.

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Heat generation in high-performance three-dimensional integrated circuits (3D ICs) is a significant challenge due to limited heat removal paths and high power density. To address this challenge, this paper presents an embedded microfluidic heat sink (MFHS) for such high-performance 3D ICs. In the proposed 3D IC system, each tier contains ...More



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