Analysis of Signal Propagation Through TSVs Within Distilled Water for Liquid-Cooled Microsystems

IEEE Transactions on Electron Devices, pp. 1176-1181, 2016.

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Abstract:

This paper analyzes the impact of liquid cooling on the electrical characteristics of through-silicon vias (TSVs) using a microfluidic cooling testbed containing TSVs. The microfabrication of TSVs in a silicon micropin-fin heat sink is presented, and the high-frequency characterization of TSVs within a micropin-fin heat sink using distill...More

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