Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers

Hanju Oh

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Paragkumar A. Thadesar

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Gary S. May

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Muhannad S. Bakir

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IEEE Microwave and Wireless Components Letters, pp. 168-170, 2016.

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Keywords:

Through-silicon viasSiliconCapacitanceRadio frequencyLoss measurementMore(2+)

Abstract:

An air-isolated through-silicon via (TSV) technique is proposed to reduce radio-frequency (RF) losses in silicon interposers. A testbed containing air-isolated and conventional TSVs is fabricated and characterized from 10 MHz to 20 GHz with an L-2L de-embedding technique. The proposed air-isolated TSV technique yields 46.7% lower insertio...More

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