Three-dimensional graphene foam and carbon fibers reinforced epoxy resin composites with enhanced thermal conductivity

Shengyun Huang,Yaqiang Ji,Haoran Wen, Kai Zhang,Matthew Ming Fai Yuen,Xian-Zhu Fu,Rong Sun,Ching-Ping Wong

2016 China Semiconductor Technology International Conference (CSTIC)（2016）

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摘要

Graphene foam (GF), carbon fibers (CFs) and GF/CFs reinforced epoxy resin composites were fabricated and their thermal properties were investigated. Due to continuous interconnected structures of GF and avoiding the CFs aggregation in epoxy resin, GF/CFs reinforced epoxy resin demonstrates greatly higher thermal conductivity than the single GF or CFs reinforced epoxy, which could provide a strong candidate for highly thermal conductive polymer composites.

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关键词

three-dimensional graphene foam,carbon fibers reinforced epoxy resin composites,enhanced thermal conductivity,thermal properties,continuous interconnected structures,CFs aggregation,highly thermal conductive polymer composites,C

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