Effects of Pre- and Post-treatment of TaN Barrier Metal Deposited by Plasma Enhanced Atomic Layer Deposition (PEALD) Method on Electromigration Resistance in Cu Interconnect
The Japan Society of Applied Physics(2008)
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要