Wettability of Selected Lead-Free Solders for Higher Application Temperatures

The work deals with the research of wettability of lead-free solders for higher application temperatures. For the research of wettability, SnSb5, ZnAl4, ZnAl6Ag6 and BiAg11 solders were used on Ag, Cu and Ni substrates. The measurement was carried out in a controlled atmosphere by trigonometric method. Zn based solders wets none of the examined substrates. SnSb5 solder wets only Cu substrate with wetting angle of 54o. Soldering alloy BiAg11 wets all substrates, wherein the best results (23 o) was achieved on Ag substrate.