High-Frequency Analysis of Embedded Microfluidic Cooling within 3-D ICs Using a TSV Testbed

Electronic Components and Technology Conference, pp. 68-73, 2016.

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In this paper, the impact of microfluidic cooling on the electrical characteristics of through-silicon vias (TSVs) is investigated for three-dimensional (3-D) integrated circuits (ICs). The design and fabrication of a testbed containing TSVs are presented for two types of heat sinks (micropin-fin and microchannel heat sinks) immersed in d...More



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