Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers
IEEE Transactions on Components, Packaging and Manufacturing Technology（2016）
Abstract
In this paper, we present for the first time a rigorous crosstalk analysis of through silicon via (TSV) arrays consisting of several hundreds of TSVs in interposers with metallized surfaces, using the physics-based via (PBV) modeling approach for applications up to 500 GHz. The PBV modeling approach is valid for complete and almost complete metallizations of the substrate where radial wave propaga...
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Key words
Through-silicon vias,Ports (Computers),Crosstalk,Computational modeling,Silicon,Adaptation models,Substrates
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