On-Chip Interconnect Conductor Materials for End-of-Roadmap Technology Nodes

IEEE Transactions on Nanotechnology(2018)

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摘要
A comprehensive review of challenges and potential solutions associated with the impact of downscaling of integrated circuit (IC) feature sizes on on-chip interconnect materials is presented. The adoption of Moore's Law has led to developments and manufacturing of transistors with nanoscale dimensions, faster switching speeds, lower power consumption, and lower costs in recent generations of IC te...
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关键词
Integrated circuit interconnections,Conductors,Transistors,Resistance,Capacitance,Logic gates
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