Monolithic-like heterogeneously integrated microsystems using dense low-loss interconnects

Xuchen Zhang
Xuchen Zhang
Paul K. Jo
Paul K. Jo

topical meeting on silicon monolithic integrated circuits in rf systems, pp. 1-3, 2017.

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Abstract:

In this paper, two integration technologies are discussed for heterogeneously integrated microsystems. First, this paper presents low-loss TSVs using an air-isolation technique for silicon interposers. The proposed air-isolated TSVs exhibit approximately 35% and 37% reduction in insertion loss and capacitance, respectively, at 20 GHz. Mor...More

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