Monolithic-like heterogeneously integrated microsystems using dense low-loss interconnects
2017 IEEE 17th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)(2017)
摘要
In this paper, two integration technologies are discussed for heterogeneously integrated microsystems. First, this paper presents low-loss TSVs using an air-isolation technique for silicon interposers. The proposed air-isolated TSVs exhibit approximately 35% and 37% reduction in insertion loss and capacitance, respectively, at 20 GHz. Moreover, this paper presents a TSV-less integration technology using bridge chips and Compressible MicroInterconnects (CMIs). Compared to other packaging and assembly options, the investigated TSV-less approach provides monolithic-like electrical performance by significantly reducing chip-to-chip interconnect length and loss, increasing interconnect density, and providing the ability to seamlessly integrate chips of diverse functionalities.
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关键词
Compressible Interconnect,Heterogeneous Integration,Silicon interposer,Through-silicon-via
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