Heterogeneous Integrated Microsystems With Nontraditional Through-Silicon Via Technologies

IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 502-510, 2017.

Cited by: 0|Views1
EI WOS

Abstract:

In this paper, the design, fabrication, and high-frequency characterization of three types of nontraditional through-silicon via (TSV) technologies are discussed. First, the integration of TSVs within a silicon microfluidic heat sink is presented; TSVs are fabricated within a pin-fin heat sink, and the frequency response of TSVs within a ...More

Code:

Data:

Get fulltext within 24h
Bibtex
Upload PDF

1.Your uploaded documents will be check within 24h, and coins will be credited to your account.

2.As the current system does not support cash withdrawal, you can add staff WeChat (AMxiaomai) to receive it as a red packet.

3.10 coins will be exchanged for 1 yuan.

?

Upload a single paper

for 5 coins

Wechat's Red Packet
?

Upload 50 articles

for 280 coins

Wechat's Red Packet
?

Upload 200 articles

for 1200 coins

Wechat's Red Packet
?

Upload 500 articles

for 3000 coins

Wechat's Red Packet
?

Upload 1000 articles

for 7000 coins

Wechat's Red Packet
Your rating :
0

 

Tags
Comments