Heterogeneous Integrated Microsystems With Nontraditional Through-Silicon Via Technologies
IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 502-510, 2017.
EI WOS
Abstract:
In this paper, the design, fabrication, and high-frequency characterization of three types of nontraditional through-silicon via (TSV) technologies are discussed. First, the integration of TSVs within a silicon microfluidic heat sink is presented; TSVs are fabricated within a pin-fin heat sink, and the frequency response of TSVs within a ...More
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