Low temperature hermetic laser-assisted glass frit encapsulation of soda-lime glass substrates

Room temperature and low temperature (120°C) laser-assisted glass frit bonding of soda-lime glass substrates are accomplished in this work. The locally laser melted bonding showed hermeticity with helium leak rate of <5×10−8atmcm3s−1, maintaining its leak rate even after standard climatic cycle tests. Small size devices were bonded at room temperature while larger areas were sealed at the process temperature of 120°C. The sealing parameters were optimized through response surface methodology that makes the process capable for further development regardless of device size.