Monolithic Integration of a Micropin-Fin Heat Sink in a 28-nm FPGA

IEEE Transactions on Components, Packaging and Manufacturing Technology(2017)

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摘要
Microfluidic cooling has been demonstrated as an effective means of cooling microelectronic circuits with a very low convective thermal resistance and potential for integration in close proximity to the area of heat generation. However, microfluidic cooling experiments to date have been limited to silicon with resistive heaters representing the heat generating circuitry. In this paper, a micropin-...
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关键词
Field programmable gate arrays,Temperature measurement,Heat sinks,Silicon,Thermal resistance,Resistance heating
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