A Low-Melting-Point Alloy Filled Epoxy Conductive Adhesives As Thermal Interface Materials

Jiahui Kang,Jiali Sheng,Xian-Zhu Fu,Rong Sun,Ching-Ping Wong

2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)（2017）

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摘要

In this paper, we reported the performances of epoxy conductive adhesives filled with a low-melting-point Sn-BiAg alloy. Results revealed the excellent stability, mechanical property of the Sn-Bi-Ag epoxy adhesives. Meanwhile, the thermal conductivity increased by increasing the content of Sn-Bi-Ag filler and 18 W m(-1) K-1 can be obtained with 85% Sn-Bi-Ag filler content.

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关键词

low-melting, epoxy conductive adhesives, Sn-Bi-Ag filler, thermal conductivity, viscosity

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