A Hierarchical Manifold Microchannel Heat Sink Array for High-Heat-Flux Two-Phase Cooling of Electronics

Kevin P. Drummond,Doosan Back,Michael D. Sinanis,David B. Janes,Dimitrios Peroulis,Justin A. Weibel,Suresh V. Garimella

International Journal of Heat and Mass Transfer（2018）

引用 216|浏览16

暂无评分

摘要

•A hierarchical manifold microchannel heat sink is fabricated and tested in two-phase operation.•A thin film, serpentine heater provides uniform heating over 5mm×5mm area.•An array of sensors monitors the device temperature field.•Heat sinks with high-aspect-ratio microchannels are etched in silicon for intrachip cooling.•Heat fluxes up to 910W/cm2 are dissipated using the dielectric fluid HFE-7100.

查看译文

关键词

High-flux,Boiling,Two-phase,Manifold,Microchannel,Intrachip electronics cooling

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要