Processing and mechanical characterization of ultrananocrisytalline diamond films for MEMS applications

2017 International Semiconductor Conference (CAS)(2017)

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摘要
We present the fabrication and mechanical characterization of MEMS-like structures from ultrananocrystalline diamond UNCD thin films. Various microstructures were fabricated using lithography and RIE processing, that is, by avoiding the sacrificial layer process. Stress assessments indicate the usability of UNCD films for MEMS components.
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关键词
ultranano-crystalline diamond film,mechanical properties,MEMS
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