In-line Optical Amplification for Silicon Photonics Platform by Flip-Chip Bonded InP-SOAs

OFC, pp. 1-3, 2018.

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Abstract:

We review the hybrid-integration of an InP semiconductor optical amplifier on a silicon photonics chip, and our in-line SOA integration using precise flip-chip bonding technology. We demonstrate the loss-less operation of a 4×4 switch with a 4ch-SOA array.

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