In-Line Optical Amplification For Silicon Photonics Platform By Flip-Chip Bonded Inp-Soas

Takeshi Matsumoto,Teruo Kurahashi,Ryotaro Konoike,Ken Tanizawa,Keijiro Suzuki,Ayahito Uetake,Kazumasa Takabayashi,Kazuhiro Ikeda,Hitoshi Kawashima,Suguru Akiyama

2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)（2018）

引用 6|浏览40

暂无评分

摘要

We review the hybrid-integration of an InP semiconductor optical amplifier on a silicon photonics chip, and our in-line SOA integration using precise flip-chip bonding technology. We demonstrate the loss-less operation of a 4x4 switch with a 4ch-SOA array.

查看译文

关键词

4ch-SOA array,InP semiconductor optical amplifier,silicon photonics chip,in-line SOA integration,flip-chip bonding technology,in-line optical amplification,InP

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要