Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

Chengshuo Jiang,Jiajie Fan,Cheng Qian,Hao Zhang,Xuejun Fan,Weiling Guo,G.Q. Zhang

IEEE Transactions on Components, Packaging and Manufacturing Technology（2018）

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摘要

High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip technology have become one of the most promising light sources. The die attach solder layer always plays an important role in heat dissipation, mechanical support, and electronic conductivity. Among different types of solder materials, Sn-3.0Ag-0.5Cu (SAC305) solder alloy shows its great competitiveness on s...

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关键词

Light emitting diodes,Microassembly,Thermal resistance,Reliability,Mechanical factors,Substrates

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