Surface Relief Structuring via Multiple Pulse Femtosecond Ablation using an Intensity Spatial Light Modulator
2018 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO)（2018）
摘要
Subtractive femtosecond laser machining using multiple pulses with different spatial intensity profiles on the same position on a sample enables surface relief structuring with up to 60 layers, 330nm spatial resolution, 3μm maximum depth.
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关键词
multiple pulse femtosecond ablation,intensity spatial light modulator,subtractive femtosecond laser machining,spatial intensity profiles,spatial resolution,surface relief structuring,depth 3.0 mum
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