Suppression of the Backgating Effect of Enhancement-Mode p-GaN HEMTs on 200-mm GaN-on-SOI for Monolithic Integration

IEEE Electron Device Letters(2018)

引用 43|浏览37
暂无评分
摘要
The backgating effect on trench-isolated enhancement-mode p-GaN devices fabricated on 200-mm GaN-on-SOI was investigated. We show that to minimize the backgating effect in the monolithically integrated half-bridge, the sources of both the low side and high side need to be connected to their respective fully isolated Si(111) device layers to keep the substrates and the sources at equipotential.
更多
查看译文
关键词
Substrates,HEMTs,MODFETs,Stress,Logic gates,Silicon,Aluminum gallium nitride
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要