Heterogeneous Multi-Die Stitching Enabled by Fine-Pitch and Multi-Height Compressible Mircointerconnects (CMIs)

Paul K. Jo
Paul K. Jo
Xuchen Zhang
Xuchen Zhang
Joe L. Gonzalez
Joe L. Gonzalez

IEEE Transactions on Electron Devices, pp. 2957-2963, 2018.

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Abstract:

A high-density and a highly scalable heterogeneous multi-die integration technology is presented in this paper. Central to this approach is a dense and face-toface integration of heterogeneous ICs enabled by fine-pitch and multi-height compressible microinterconnects (CMIs) and stitch chips, which serve as the interface through which comm...More

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