STI scratch defects reduction by using solid pad in 1X technology node

Yen-Ting Chen
Yen-Ting Chen
Chun-Fu Chen
Chun-Fu Chen
Lin-Wuu Yang
Lin-Wuu Yang
Yuchi Tay
Yuchi Tay
Yi Ming Chen
Yi Ming Chen
Johnson Ton
Johnson Ton
Yen Pin Lu
Yen Pin Lu

china semiconductor technology international conference, 2018.

Cited by: 0|Bibtex|Views4|DOI:https://doi.org/10.1109/cstic.2018.8369263
Other Links: academic.microsoft.com

Abstract:

CMP scratch defects reduction plays an important role in yield improvement. In this paper, pad debris reduction and solid pad evaluation are applied to reduce scratch formation. Novel solid pad with high removal rate and less dressing amount demonstrate the good performance of scratch defects generation and get the better productivity. As...More

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