Post-CMOS Fabrication Technology Enabling Simultaneous Fabrication of 3-D Solenoidal Micro-Inductors and Flexible I/Os
IEEE Transactions on Components, Packaging and Manufacturing Technology（2018）
摘要
In this paper, co-fabrication and characterization of micro-inductors with mechanically flexible interconnects (MFIs) as I/Os is presented. A double-lithography and double-reflow process is used to obtain different heights of reflowed photoresist domes for the micro-inductors and the MFIs. The developed process allows fabrication of MFIs with different heights, pitches, and materials. The fine-pit...
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关键词
Inductors,Fabrication,Substrates,Inductance,Q-factor,Copper,Resists
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