Reduced thermal resistance of heat sink using graphene oxide decorated with copper nanoparticles

•Three–dimensional thermal interface materials made of graphene oxide and copper nanoparticles (GO–Cu NPs) have synthesized.•The effect of the stacking order of GO–Cu NPs on thermal resistance has explored for enhancing LED heat dissipation.•Analysis by a FLIR camera has showed that the combination of GO and Cu NPs enabled heat dissipation properties.•The thermal resistance of the mixed GO–Cu NPs structure is less 37 % than that of the Al heat sink.