Engineering and Stack Optimization of Cu -Based Selector Devices for Low Power SCM Applications

2018 IEEE International Memory Workshop (IMW)(2018)

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摘要
In this paper we demonstrate a unipolar selector based on Cu-based active layer. Volatile conductive bridge concept is explained by the means of electrical results and material properties such as device area, Cu-based active layer -thickness and composition. Beside the standard stack, the integration of a thin interfacial layer of 1nm metal oxide allows to improve VCB nonlinearity up to 6 decades, by decreasing initial current leakage to 1nA and switching V to 2.5V/1μs. Good endurance behavior is shown with more than 1E5 cycles obtained without degradation. Good switching temperature stability is demonstrated up to 125°C for both standard and HfO 2 /Cu-based stacks.
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关键词
Cu-based selector devices,VCB nonlinearity,HfO2-Cu-based stacks,good switching temperature stability,good endurance behavior,initial current leakage,interfacial layer,standard stack,material properties,volatile conductive bridge concept,unipolar selector,low power SCM applications,stack optimization,current 1.0 nA,voltage 2.5 V,temperature 125.0 degC,size 1.0 nm
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