Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)（2018）
Key words
semiconductor devices,critical strength,multiscale modeling approach,interfacial properties,chemical bonds,atomistic interfacial structures,interfacial failure characterization,electronic packaging component,multiscale modelling approach,fracture criterions,Cu-SiO2
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