Electrical Signatures of Corrosion and Solder Bond Failure in c-Si Solar Cells and Modules

Moisture- and temperature-activated corrosion of metal fingers, mechanical stress induced delamination, and failure of solder bonds rank among the leading failure mechanisms of solar modules. The physics of moisture ingress, diffusion, and reaction have been explored in detail, but the electrical implications of corrosion and delamination on specific front-surface grid geometry is not fully understood. In this paper, we show that the module efficiency loss due to corrosion, delamination, and solder bond failure (CDS) involves a complex interplay of voltage/current redistribution, reflected as a loss in photocurrent, as well as decrease/increase in shunt/series resistances. The analysis presented in this paper will redefine the interpretation of experimental I–V characteristic features due to degradation mechanisms, integrate a variety of scattered and counter-intuitive experimental results within a common theoretical framework, and inform CDS-resistant grid design for solar modules.