In-Line Optical Amplification For Si Waveguides On 1x8 Splitter And Selector By Flip-Chip Bonded Inp-Soas
2016 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC)（2016）
摘要
We investigated hybrid-integration of InP semiconductor optical amplifier on silicon photonics chip using flip-chip bonding, and achieved in-line optical amplification of 10 dB. Silicon 1x8 splitter and selector are fabricated and operated with on-chip loss-compensation.
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关键词
on-chip loss compensation,flip-chip bonding,silicon photonics chip,hybrid integration,semiconductor optical amplifiers,flip-chip bonded InP-SOA,selector,splitter,waveguides,in-line optical amplification,Si-InP
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