Hotspot Thermal Management via Thin-Film Evaporation—Part I: Experimental Characterization

IEEE Transactions on Components, Packaging and Manufacturing Technology(2018)

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摘要
The presence of hotspots with extreme heat fluxes and temperatures in high-performance electronics has led to severe thermal management challenges in the semiconductor industry. Our work experimentally investigates the potential of capillary-fed thin-film evaporation as a thermal management solution for devices where hotspots are superposed with mild background heating. The front side of our test ...
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关键词
Heating systems,Liquids,Reservoirs,Silicon,Heat sinks
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