A Novel 3D AND-type NVM Architecture Capable of High-density, Low-power In-Memory Sum-of-Product Computation for Artificial Intelligence Application

symposium on vlsi technology, 2018.

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Abstract:

An AND-type stackable 3D NVM architecture is proposed to provide an ultra-high density AI computing memory with low power. The advantages are: (1) All memory transistors in the 3D array are connected in parallel, thus enable the sum-of-product operation. (2) The 3D NAND like architecture is possible to stack to u003e 64 layers, thus provi...More

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