Photonic Integrated Circuit Design and Packaging for Submarine Optical Amplification

This paper gives an insight into a Brazilian project which aims to develop a photonic integrated circuit (PIC) and packaging for submarine optical repeaters. The PIC design in order to achieve single-mode operation in both 980nm and 1.55μm is detailed. A high-reliability packaging technique is demonstrated. A transmission experiment with 200Gbps 16-QAM signal is achieved using the optical amplifier with the PIC.