Pressureless joining of SiC ceramics at low temperature

Pressureless joining of SiC ceramics at low temperature was developed using Ti powder interlayer. Phase assemblage and microstructure of SiC joint revealed that the products after diffusion bonding mainly consisted of Ti5Si3 and TiC owing to the comparatively low joining temperature. Additionally, Si and C elements were found to be with higher penetration depth in the Ti interlayer. Benefitting from the lower proportion of the brittle Ti5Si3 phase and porosity, shear strength reached a relatively higher value of 41 MPa after joining at 1200 degrees C for 30 min.