Editor’s note:
Thin-film transistors can be manufactured at low cost and on flexible materials using printing technologies. These characteristics make them very well suited to many IoT applications, particularly wearable electronics. However, circuit and system designers require device models for these new devices. This article describes a SPICE-compatible compact model for a range of thin-film transistors. The authors have validated the models on three thin-film transistor technologies. —
Dimitrios Serpanos, University of Patras
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Marilyn Wolf, Georgia Institute of Technology
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关键词
Thin film transistors,Integrated circuit modeling,Logic gates,Semiconductor device modeling,Silicon,Sensors,Contact resistance