Reducing interfacial thermal resistance between metal and dielectric materials by a metal interlayer

Xiangyu Li
Xiangyu Li
Wonjun Park
Wonjun Park

Journal of Applied Physics, no. 4 (2019): 045302

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Abstract:

Interfacial thermal resistance between metal and dielectric materials is a bottleneck of the thermal management for modern integrated circuits as interface density increases with thinner films. In this work, we have observed that the interfacial resistance across gold and aluminum oxide can be reduced from 4.8 × 10 − 8 m 2 K / W to 1.4 × ...More

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