Monolithic Integration of Micron-scale Piezoelectric Materials with CMOS for Biomedical Applications

2018 IEEE International Electron Devices Meeting (IEDM)(2018)

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摘要
We present the development of micro-fabrication techniques achieving the monolithic integration of micron-scale piezoelectric ultrasonic transducers in both polyvinylidene difluoride (PVDF) and lead zirconate titanate (PZT) with complementary metal-oxide-semiconductor (CMOS) integrated circuits (ICs). PVDF-CMOS integration is driven by applications in energy harvesting and data telemetry for medical implants, while PZT-CMOS integration is applied to high-resolution two-dimensional (2D) ultrasound imaging. Both of these applications benefit from reduced parasitic capacitances and higher levels of integration possible with monolithic CMOS integration. Characterization results of micro-fabricated devices reveal the preservation of the piezoelectric properties of PVDF and PZT and transducer functionality with co-designed CMOS ICs.
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关键词
monolithic integration,microfabrication techniques,micron-scale piezoelectric ultrasonic transducers,polyvinylidene difluoride,complementary metal-oxide-semiconductor integrated circuits,PVDF-CMOS integration,energy harvesting,data telemetry,PZT-CMOS integration,high-resolution two-dimensional ultrasound imaging,monolithic CMOS integration,lead zirconate titanate,PZT
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