Demonstration of 50-mV Digital Integrated Circuits with Microelectromechanical Relays
2018 IEEE International Electron Devices Meeting (IEDM)(2018)
摘要
50-mV operation of digital integrated circuits at room temperature is demonstrated for the first time using body-biased microelectromechanical relays. An improved relay design and self-assembled molecular coating provide for lower contact adhesion to reduce hysteretic switching behavior, so that the relays operate reliably with sub-50-mV gate voltage swing to provide for ultra-low active power consumption as well as zero static power consumption.
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关键词
hysteretic switching,relay design,digital integrated circuits,self-assembled molecular coating,body-biased microelectromechanical relays
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