A Complete Explanation of Warpage Behavior Across Backend Processes on Organic BGA in Strip Form and Its Predictive Methodology

Controlling warpage in backend manufacturing is a challenge that needs to be tackled in early design stage. Failure to do so may result in later manufacturability or reliability issues. This is of particular importance in BGA automotive packages where warpage could influence not only backend workability but also later thermal cycling reliability performance of the package mounted on board. Previous study has dealt separately with post Post Mold Curing (PMC) and post reflow processes. Experimental trials have been performed followed by material characterization tests and Finite Element Method (FEM) methodology development. This paper deals with a complete explanation of BGA warpage behavior in backend and provides a reliable guideline for new design bill of material selection with the intention to design for manufacturability and reliability at an early stage. In doing so design cycles can be significantly reduced as will be the need for exhaustive design of experiment.