SEIFF: Soft Error Immune Flip-Flop for Mitigating Single Event Upset and Single Event Transient in 10 nm FinFET

Taiki Uemura,Soonyoung Lee,Dahye Min, Ihlhwa Moon,Seungbae Lee,Sangwoo Pae

2019 IEEE International Reliability Physics Symposium (IRPS)（2019）

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摘要

This paper proposes soft error immune flip-flop (SEIFF) for mitigating single event upset (SEU) in flip-flops (FFs) and impact of single event transient (SET) in combinational-logic. SEIFF mitigates the SET without enlarging setup-time and delay; there is no overhead in circuit performance. Alpha and proton tests validate the mitigation efficiency in SEIFF manufactured on 10 nm FinFET technology.

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关键词

soft error,single event upset,single event transient,alpha,proton,mitigation technique

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