Mask and Template Assignment on DSA-MP with Triple BCP Materials Lithography

2019 China Semiconductor Technology International Conference (CSTIC)(2019)

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摘要
In the sub-7nm technology nodes, as the mask cost for printing the dense via layers increases dramatically with conventional lithography techniques, triple block copolymer (triple-BCP) materials for directed self-assembly (DSA) lithography is considered as a promising technology to reduce the mask cost. In this paper, we consider triple-BCP and template assignment for triple patterning lithography with DSA. Firstly, we formulate the problem as a maximum weighted independent set (MWIS) problem, and then use the integer linear programming (ILP) to obtain its solution. Furthermore, to gain a better trade-off between runtime and solution quality, we proposed a modification of the Fiduccia-Mattheyses heuristic method (MCFM) to efficiently solve the MWIS problem. Experimental results verify the effectiveness of our method, and indicate that adopting three different BCP materials can dramatically reduce conflict numbers compared with existing works using double BCP materials.
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关键词
double BCP materials,DSA-MP,conventional lithography techniques,directed self-assembly lithography,triple-BCP assignment,template assignment,triple patterning lithography,maximum weighted independent set problem,integer linear programming,Fiduccia-Mattheyses heuristic method,MWIS problem,technology nodes,mask cost reduction,mask assignment,triple BCP material lithography,dense via layers,triple block copolymer materials,DSA lithography,MCFM,size 7.0 nm
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