Structural Analysis And Resistivity Measurements Of Inas And Gasb Fins On 300mm Si For Vertical (T)Fet

We report on the uniform selective area growth of InAs and GaSb by metal-organic vapor phase epitaxy on a patterned shallow trench isolation SiO2/Si 300mm template. High-quality InAs fins are realized via direct InAs nucleation on Si in the trenches. 60 degrees interfacial misfit dislocation arrays formed along the {111} oriented InAs/Si interfaces accommodate most of the lattice mismatch such that threading dislocation generation from residual strain is minimized. GaSb grown on a thick GaAs buffer (partial filling of the trench) suffers from twin formation. The twin density is found to decrease with increasing growth temperature. To maximize the volume of low-defect density material inside the trench, the GaSb growth is initiated as close as possible to the trench bottom. Therefore, uniform high-quality GaSb fins are grown on a very thin low-temperature GaAs and the newly developed InAs seed in the V-groove. High-resolution x-ray diffraction reciprocal space maps show that the InAs and GaSb fins are nearly completely relaxed. The resistivity of undoped and n-doped InAs and undoped and p-doped GaSb fins is measured on as-grown material by micro-4-point-probe without the need for additional complicated device processing. The values are compared to those required for devices as presented in modeling papers. The result is encouraging for the ultra-large-scale integration of vertical nanowire III-V (tunnel) field-effect transistor on 300mm Si.