Microfluidic Cooling of a 14nm 2.5D FPGA with 3D Printed Manifolds for High Density Computing: Design Considerations, Fabrication, and Electrical Characterization

The 2.5-D integration is becoming a common method of tightly integrating heterogeneous dice with dense interconnects for efficient, high-bandwidth inter-die communication. While this tight integration improves performance, it also increases the challenge of heat extraction by increasing aggregate package powers and introducing thermal crosstalk between the adjacent dice. In this article, a microfl...