Sintering of binderless cubic boron nitride and its modification by β-Si3N4 additive for hard machining applications

This study present the results of HP-HT sintering, microstructure, properties, and performance of binderless cBN tool material. Within the investigated sintering temperature range of 1900–2600 °C the optimum was found to be 2200–2300 °C. Lower temperature results in incomplete diffusion bonding between cBN grains, while higher temperature results in high degree of recrystallization of initial structure, grain growth, and even formation of hexagonal boron nitride in triple joints. Introduction of stress-inducing β-Si3N4 minor inclusions resulted in high overall mechanical and thermal properties: HK = 41 GPa; KIC = 12.6 MPa·m1/2; λ = 180 W/(m·K). Machining experiments in roughing of hardened tool steels show that binderless cBN material provides high performance in terms of resistance to tool cratering, chipping, and tool fracture.