A Novel Double-Density Hemi-Cylindrical (HC) Structure to Produce More than Double Memory Density Enhancement for 3D NAND Flash
international electron devices meeting, 2019.
A novel hemi-cylindrical (HC) 3D NAND Flash architecture is demonstrated for the first time. HC 3D NAND squeezes the gate-all-around (GAA) hole in one direction, followed by a slit cut to split the GAA device to produce twin cells. It creates ~ 2.6 times of memory density increase than standard GAA 3D NAND at the same stacking layer. Both...More
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