High- Q Three-Dimensional Microfabricated Magnetic-Core Toroidal Inductors for Power Supplies in Package

The integration of power inductors is a roadblock in realizing highly miniaturized power supply in package (PSiP) and power supply on chip. Inductors in such power systems are used for energy storage and filtering, but they dominate in size and loss. This paper presents a novel three-dimensional in-silicon through-silicon via (TSV) magnetic-core toroidal inductor for PSiP. The magnetic powder base...