Study of Plasma Arcing Mechanism in High Aspect Ratio Slit Trench Etching

2019 30TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2019.

Cited by: 0|Bibtex|Views1

Abstract:

The abnormal process issue, arcing, was met in recipe development of high aspect ratio (HAR) trench etching. The arcing mechanism is proposed by continuous growth of polymer upon hard-mask along pattern boundary during deep trench etching. It leads to excess charge trapped and high potential difference between polymer and substrate. Event...More

Code:

Data:

Your rating :
0

 

Tags
Comments