Redistribution of Mg and H atoms in Mg-implanted GaN through ultra-high-pressure annealing

APPLIED PHYSICS EXPRESS(2020)

引用 27|浏览15
暂无评分
摘要
Diffusion in a magnesium (Mg)-implanted homoepitaxial GaN layer during ultra-high-pressure annealing (UHPA, in ambient nitrogen, under 1 GPa) was investigated. Annealing at 1573 K resulted in Mg-segregation at the edge of the implanted region, which was suppressed using a higher temperature of 1673 K. Hydrogen (H) atoms were incorporated during the UHPA, resulting in the Mg and H developing the same diffusion profile in the deeper region. The diffusion coefficient of the Mg-implanted sample was 3.3 x 10(-12) cm(2) s(-1)at 1673 K from the annealing duration dependence, 30 times larger than that of the epitaxial Mg-doped sample, originating from ion implantation-induced defects.
更多
查看译文
关键词
Semiconductor,GaN,Fabrication process,Power device,Mg-implantation,Post-implantation-annealing,diffusion
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要