BEOL-Embedded 3D Polylithic Integration: Thermal and Interconnection Considerations

Ankit Kaul
Ankit Kaul
Sreejith Kochupurackal Rajan
Sreejith Kochupurackal Rajan
Obaidul Hossen
Obaidul Hossen

electronic components and technology conference, pp. 1459-1467, 2020.

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Abstract:

In this paper, a BEOL-embedded chiplet integration scheme is proposed for dense 3D integration. This scheme represents a system with multiple device tiers (primary and embedded tiers) where custom chiplets, such as voltage regulator modules, I/O drivers, RF front-end chips, etc. are embedded into the BEOL of an application processor tier ...More

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