Oval-Shaped OP-Layer Hole Etching: Shape Deformation, Local Arcing, and Hole Bridging Improvements

advanced semiconductor manufacturing conference, 2020.

Other Links: academic.microsoft.com

Abstract:

The challenges of oval-shaped silicon dioxide and polysilicon (OP)-layer hole etching, including shape deformation, local arcing, and adjacent hole bridging are reported. We explore the shape deformation evolution step by step and point out that wiggling of the organic mask is the most critical factor to enhance the occurrence of shape de...More

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